| 摘要 |
<p>PURPOSE:To prevent occurrence of troubles due to cracks of a substrate or bending of a pin when inserting a pin by providing a projecting pad to a section to pick up a signal line. CONSTITUTION:A projecting pad 4 is provided to a section to pick up a signal line at on the rear of a substrate 1. This eliminates the necessity of a pin to be inserted and a socket, and enables direct soldering through the pad 4 when joined with a printed wiring board. When the pad 4 is formed, copper foil laminated on a carrier film 5 is etched and a copper piece 6 which becomes the pad 4 is formed at a position corresponding to a through hole 2 of the section for picking up a signal line of the substrate 1. Then conductive adhesive is applied to the section for picking up a signal line and registered to the copper piece 6 for laminating. The adhesive is cured, and the film 5 is removed to form the pad 4.</p> |
