| 摘要 |
PURPOSE:To form a fine pattern by using an electrodeposition type UV resist as an etching resist. CONSTITUTION:A hole 3 is made in a copper-clad laminating board on which a copper foil 2 is laminated on a base material 1 and a catalyst 4 is filled in the wall face of the hole. Then, an electrodeposition type UV resist is deposited onto the whole surface including side face parts facing to the hole 3 of a copper foil 2 to form an electrodeposition type UV resist film 5. An electrodeposition type UV resist film 5' is formed into a prescribed pattern by exposure and development. Subsequently, a copper foil 2' is formed into the prescribed pattern by using an etchant which does not dissolve the catalyst 4. Then, the film 5' is removed after being dissolved. A solder-resist film 6 which is proof against plating is formed on the surface other than the hole 3 and a through hole land part. Further, a chemical copper-plating film 7 is formed in the hole 3 and at the through hole land. As this approach makes it possible to form a fine pattern and makes a difference between the diameter of land in the through hole part and the diameter of the hole small, a packaging density of a printed wiring board is improved exceedingly. |
