PROCEDIMENTO A BASSA TEMPERATURA PER LA FORMAZIONE DI RIVESTIMENTI CERAMICI

摘要

A single or multilayer ceramic or ceramic-like coating process is provided which can be applied to heat sensitive substrates such as electronic devices. The process includes the steps of coating the substrate with a solution comprising a hydrogen silsesquioxane resin diluted in a solvent and then evaporating the solvent, thereby depositing a preceramic coating on the substrate. The preceramic coating is then ceramified to a silicon dioxide-containing ceramic by heating the preceramic coating to a temperature of between about 40 DEG to about 400 DEG C. in the presence of ozone which enhances the rate at which the ceramification proceeds and permits the ceramification of the coating to proceed at low temperatures. Additional layers of ceramic materials may be deposited over the initial layer and act as passivating and/or barrier protective layers.