| 摘要 |
PURPOSE:To enable relatively thin packaging of high density by laminating an LSI chip on a printed wiring board without putting it into a package. CONSTITUTION:A plurality of LSI chips 1 are laminated on a printed wiring board 6 and a lead 3 of each LSI chip 1 is bent to a required shape to be connected with an electrode 7 of the printed wiring board 6. Since the lead 3 is constituted through the film carrier system, it has interchangeability and can be formed to the required shape readily. Even if the lead 3 is led out horizontally from the LSI chip 1, it is possible to deform the lead 3 easily by laminating the chip 1 and then by pressing the lead 3 with a heating jig such as a pulse tool, and to joint it with an electrode 7 of the printed wiring board 6 through heating. |
