| 摘要 |
<p>PURPOSE:To decrease noises caused by a power source without interrupting the operational speed-up and the high integration of a semiconductor device by a method wherein a semiconductor chip provided with two or more power source pads, a power source lead possessed of two or more inner lead sections connected with each other, and a specified number, of signal leads are hermeti cally enveloped in a package. CONSTITUTION:A semiconductor chip 6 provided with a specified number of signal pads 7 and two or more power source pads 8a-8f, a power source lead 4 possessed of two or more inner lead sections which are connected with each other, and a specified number of signal leads 2 are hermetically enveloped in a package. If a large power source noise is generated when four output buffers D0-D3 start operating at a time to make a charging and a discharge current increase or decrease instantaneously, the power source noise is transmit ted to a power wiring 10 or another block through a long path composed of the output buffers D0-D3, the power source pads 8d and 8e, a wire 9, a power source lead 4, and power pads 8a-8c and 8f connected to the other block, so that the power source noise is attenuated in the above path through a floating capacitance and a resistance of the power source lead 4.</p> |
