| 摘要 |
PURPOSE:To perform inspection accurately with high reliability by together using an X-ray imaging means and an optical imaging means and obtaining an X-ray image and an optical image by both imaging means to compare and collate the characteristic quantities of both images. CONSTITUTION:A transmitted X-ray image of a double-side mounting printed circuit board 2 is obtained by an X-ray imaging means 4 and the optical image of one surface of said board 2 within the same visual field as the X-ray image is obtained by an optical imaging means 6. Characteristic quantities are respectively extracted from the X-ray image and the optical image by the first and second image characteristic quantity extraction means 9a, 9b to be compared and collated by an image comparing/collating means 10. Next, on the basis of the compared and collated result, it is judged and confirmed which side of the front and rear ones of the board 2 the data of the taken images are present on, by an image confirming means 11. On the basis of this confirmation result, it is confirmed which side of the front and rear surfaces of the board 2 an electronic part or wiring pattern is present on to inspect the electronic part or wiring pattern in a quality judge means 12. |
