Arrangement for cooling components which dissipate lost heat

摘要

The invention relates to an arrangement for cooling components which dissipate lost heat, in particular wafer cell semiconductors via heat sinks preferably via isolated heat sinks. In order in the case of air cooling to achieve an improvement in the cooling of power semiconductor devices, in particular in insulated cooling systems which, e.g., can be at frame potential, and in order to compensate even the increase in thermal resistance which occurs in the case of electrical (galvanic) isolation between the power semiconductor and heat sink by thermally conductive solid-state insulators, it is proposed that heat pipes (2, 2a) are integrated in the heat sink(s) (1, 1a) for isothermalisation purposes. If heat-conducting brackets are to be used for double-sided cooling, heat pipes can also be integrated in the heat-conducting brackets. Various possibilities of embodiment are presented. <IMAGE>