| 摘要 |
<p>PURPOSE:To protect a semiconductor chip and metallic wire and to improve high frequency characteristics of a semiconductor device by assembling the components on a lead frame, soldering the cap on the lead frame and injecting sealing resin into the cap for sealing the device, CONSTITUTION:A semiconductor chip 6 is bonded to a lead frame 10 by means of a gold solder. The semiconductor chip 6 is electrically connected with the lead frame (outer lead) 10 by metallic wire 7 or the like so that the electrode is connected externally. Then a ceramic cap 8 having a metallized section 8a at a place where the lead frame 10 is to be bonded is bonded and assembled to the lead frame 10. Sealing resin 11 of epoxy resin or the like is injected into the ceramic cap 8 to provide a semiconductor device.</p> |
