发明名称 Resin composition for laminate.
摘要 <p>A resin composition for laminate, which comprises 100 parts by weight of a composition (B), from 0.5 to 10 parts by weight of dicyandiamide and from 1 to 100 parts by weight of a linear polymer, said composition (B) comprising (i) a composition (A) comprising from 20 to 80 parts by weight of a polyfunctional epoxy compound of the formula: &lt;CHEM&gt; wherein R is H or CH3 and n is an integer of from 0 to 5, and from 80 to 20 parts by weight of an epoxy compound having two epoxy groups in one molecule, and (ii) an aromatic diamino compound incorporated in the composition (A) in such an amount that its active hydrogen is from 0.3 to 0.8 equivalent per equivalent of terminal epoxy groups.</p>
申请公布号 EP0352550(A2) 申请公布日期 1990.01.31
申请号 EP19890112790 申请日期 1989.07.12
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 NAKAJIMA, HIROYUKI MITSUBISHI DENKI K.K.;TAKAHAMA, TAKASHI MITSUBISHI DENKI K.K.;MIYAMOTO, FUMIYUKI MITSUBISHI DENKI K.K.;OKA, SEIJI MITSUBISHI DENKI K.K.;ISOOKA, TOSHIO MITSUBISHI DENKI K.K.;MARUYAMA, YOSHIHIRO MITSUBISHI DENKI K.K.;YAMAMOTO, YASUSHI MITSUBISHI DENKI K.K.
分类号 B32B15/08;B32B27/38;C08G59/32;C08G59/56;C08J5/24;C08L63/00;H05K1/03 主分类号 B32B15/08
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