| 摘要 |
<p>PURPOSE:To prevent a semiconductor substrate from cracking by holding a bump electrode in the recess of a flat plate, and polishing the rear of the substrate in a state that the plate adheres to the front face of the substrate. CONSTITUTION:When the rear face of a semiconductor substrate 11 is polished, a transparent glass plate 18 adheres to the front face of the substrate 11 beforehand. In this case, wax 17 containing a solder bump electrode 15 in a cavity 19 of one flat surface of the plate 18 is heated by a halogen lamp or the like to be softened thereby to allow the plate 18 to adhere to the substrate 11. Further, at the time of adhering, the pattern of the cavity 19 can be observed from the reverse face to the cavity 19 with the plate 18, and the solder bump electrode pattern can be also confirmed through the plate 18. Thus, the electrode 15 can be aligned to the cavity 19 sufficiently by an alignment technique. The rear face of the substrate 11 can be polished in this state in a predetermined thickness, and the wax 17 is then removed.</p> |
