| 摘要 |
<p>Hot melt adhesives, useful for both glue-pot and glue-gun applications, are formulated so that they can be applied at temperatures no higher than 280 DEG F. and preferably at temperatures of at most 250 DEG F. The adhesive compositions have a heat resistance of at least 125 DEG F. and are readily shaped into glue sticks for use in glue guns. The adhesive for the hot-melt adhesive compositions is suitably compounded with tackifying resin and/or wax. The resulting composition has a sharp viscosity profile, which is readily achieved, e.g., by using a high melt index adhesive polymer as an essential component.</p> |
