| 摘要 |
PURPOSE:To prevent the generation of cracks on the connection part of an internal wiring at the time of mounting, by a method wherein one or more connection parts of an internal lead and a bonding wire, in addition to the conventional connection part, are arranged on the lead near a semiconductor chip, and the thickness of bonding wire of said connection part is made thicker than the thickness of the conventional connection part. CONSTITUTION:The title device is formed by resin-sealing a constitution body wherein the internal lead 2 of a lead frame on which a semiconductor chip is mounted and an electrode pad of the semiconductor chip are connected by a bonding wire 1. This device has a first connection part 10 where the internal lead 2 and the bonding wire 1 are connected by pressur-welding and, in addition, a second connection part 11 where at least one part is connected by pressure welding in a region of the internal lead 2 closer to the semiconductor chip than the first connection part 10. The thickness of the bonding wire 1 of the second connection part 11 is formed so as to be thicker than that of the first connection part 10. |
