| 摘要 |
<p>PURPOSE:To prevent warping and strain in a semiconductor element and a wiring board and to make it possible to perform highly reliable connection by diving loads in compression into the two stages of the first high load and the second low load, and hardening an insulating resin at the time of the second low load. CONSTITUTION:An insulating resin 3 is applied on a region including a conductor wiring 1 in a wiring board 2. Protruding electrodes 4 are provided, and an LSI chip 5 is formed. The protruding electrodes 4 and the conductor wires 1 are provided so that their positions agree. Then, the LSI chip 5 is compressed with a compressing tool 6 so as to apply a first load 7. Since the first load 7 is very large, warping and strain are generated in the LSI chip 5 and the wiring board 2. Then, under the state wherein the compressing tool 6 is in contact with the LSI chip 5, a second load 8 is set so that warping and strain are not generated in the LSI chip 5 and the wiring board 2. The second load 8 is, e.g., about 1/3-1/20 of the first load. Then the insulating resin 3 is hardened under the state wherein the LSI chip 5 is compressed. As the hardening method, ultraviolet rays are projected on the rear surface of the wiring board 2 when the wiring board 2 is a transaprent board.</p> |
