发明名称 WAFER WITH GROUND NOTCH AND GRINDING DEVICE THEREOF
摘要 PURPOSE:To obtain a wafer having no trouble due to the inclination of a notch by providing a reference pin for finally correcting the notch position integrally with a grindstone mechanism in the grinding position of the notch of the wafer located on a work table. CONSTITUTION:A reference in 24 integral with a grindstone mechanism is fitted into this notch 2 immediately before bevelling by grinding the ridge line of the notch 2 formed at the outer peripheral part of a wafer 1 on a table. The notch 2 position of the wafer 1 is thus finally corrected, the mechanical and quantization errors of a control mechanism are completely corrected and the ridge line of the notch 2 is subjected to grinding and bevelling with the outer diameter at the part close to the notch 2 and the notch center line as the reference.
申请公布号 JPH0230464(A) 申请公布日期 1990.01.31
申请号 JP19880176243 申请日期 1988.07.16
申请人 DAIICHI SEIKI KK 发明人 HIRANO YOSHIYA
分类号 B24B9/00;B24B9/06;H01L21/304 主分类号 B24B9/00
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