发明名称 BONDING EQUIPMENT
摘要 PURPOSE:To obtain a small-sized equipment excellent in workability by constituting a shielding plate of a thin plate capable of bending, installing rollers to guide the shielding plate on both sides of a cover in order to horizontally arrange the shielding plate above the cover, and energizing downward the end- portion, of the shielding plate, opposite to an XY table by a spring. CONSTITUTION:The title equipment is provided with the following; a heat block 11 to heat a substrate, a cover 12 fixed so as to cover the upper part of the heat block, an XY table 25 whose upper stage is constituted of an X table 27, and a shielding plate 34 covering an aperture part 12a of the cover 12, one end of which plate is fixed to a Y table 26. Reducing gas or the like is made to flow between the heat block 11 and the cover 12, and bonding is performed with a bonding tool 21 through a bonding-working window 34a and the aperture part 12a. In such a bonding equipment, the shielding plate 34 is constituted of a thin plate capable of bending, and rollers 30, 31 to guide the shielding plate 34 are installed on both sides of the cover 12, so as to arrange the shielding plate 34 horizontally above the cover 12. The end-portion, of the shielding plate 34, opposite to the XY table 25 is energized downward by a spring 36.
申请公布号 JPH0230151(A) 申请公布日期 1990.01.31
申请号 JP19880180776 申请日期 1988.07.19
申请人 SHINKAWA LTD;KYOCERA CORP 发明人 HASEGAWA TAKESHI;TORIHATA MINORU;KOBAYASHI TOMIO;HISATAKA MASAFUMI;OBA KOICHI;ODA TSUTOMU
分类号 H01L21/60;H01L21/52 主分类号 H01L21/60
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