发明名称 A PLASTICS-ENCAPSULATED CIRCUIT ELEMENT
摘要 A high voltage circuit element (16) is connected with a number of external leads (19, 21, 22) which are close to one another. The assembly is enclosed in a plastic encapsulation (26), the surface of which is stepped (28) between adjacent leads (19, 21 and 21, 22) in order to increase the surface path between the leads.
申请公布号 EP0098051(B1) 申请公布日期 1990.01.31
申请号 EP19830303116 申请日期 1983.05.31
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 YASUI, MITSURU C/O PATENT DIVISION
分类号 H01L23/48;H01L23/28;H01L23/31;H01L23/495 主分类号 H01L23/48
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