发明名称 DIE BONDING AND DIE BONDING DEVICE
摘要 PURPOSE:To prevent the production of bubbles in bonding paste for a rectangular die of large length and breadth ratio by performing the specific arrangement of a nozzle on which bonding paste is applied on the die pad surface. CONSTITUTION:Bonding paste 4 is applied in the form of spots by the use of a nozzle 22 composed of a first nozzle row 21 arranged along the longitudinal center line of a die 6, a first - a fifth nozzle rows 26-29 radially extended toward the outside from the nozzles of both the ends of the first nozzle row 21 and a sixth nozzle row 23-25 arranged at a right angle to the first nozzle row 21. Thereby the bonding paste 4 can be expanded without the air enclosed between neighboring pieces of paste even if the ratio of the length and breadth of the rectangular die 6 is large.
申请公布号 JPH0228337(A) 申请公布日期 1990.01.30
申请号 JP19890110398 申请日期 1989.04.27
申请人 MATSUSHITA ELECTRON CORP 发明人 YOSHIDA HIROYOSHI
分类号 H01L21/52;B05C5/00 主分类号 H01L21/52
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