| 摘要 |
Selected areas of a metal substrate are coated by first coating the area, with a removable protective area, blanket coating the surface of the substrate with a heavy metal film, heating to diffuse and alloy the heavy metal film and removing the heavy metal film from the non-protected area and also removing the protective layer and overlaying heavy metal film from the selected areas. Also claimed is a process of selectively coating gold on exposed metal areas. The process is used to deposit metal onto a selected portion of a pattern on a ceramic substrate carrier of the type used for mounting semiconductor. |
