Method of processing siloxane-polyimides for electronic packaging applications

摘要

A method of forming a multilayer metallization pattern using siloxane polyimide dielectric layers comprises forming the first siloxane polyimide layer, laser etching holes in the first layer, plasma etching the first layer to be sure the holes are clean, then cleaning the surface of the first layer in an etchant for silicon oxide, after which the metallization layer is formed and patterned and a second siloxane polyimide layer is formed thereover with good adhesion.