发明名称 |
Process to manufacture printed circuit boards |
摘要 |
Printed circuit boards (PCBs) are disclosed comprising a support which on a major side carries circuit components in a desired design and on a second major side carries the soldered wires corresponding to said circuit components. Manufacturing of the PCBs is carried out by producing respective designs of the component and soldering sides as labile electrostatic images on which conductive metallic powder (toner) is applied. The so obtained images are printed on respective insulating sheets, one with the component side design, and another with the solder side design. The thus printed sheets are fixed on the PCB support, and the conductive designs are treated to increase the thickness of the design.
|
申请公布号 |
US4897326(A) |
申请公布日期 |
1990.01.30 |
申请号 |
US19860835479 |
申请日期 |
1986.03.03 |
申请人 |
TELETTRA-TELEFONIA ELECTRONICA E RADIO, S.P.A. |
发明人 |
MARENGO, GIUSEPPE |
分类号 |
H05K1/02;H05K3/10;H05K3/12;H05K3/18;H05K3/20;H05K3/24 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|