| 摘要 |
<p>PURPOSE:To enable highly accurate mounting of a flat package IC by providing a small and cheap device using a sensor, and detecting only the lead wire of one part using this device, and operating the position error in accuracy at a necessary and enough level. CONSTITUTION:A sensor 11 which detects, by scanning, the lead position of a wiring pattern at a mounting part of a flat package IC, and an arithmetic unit 12 which seeks the position of the center or the external shape of the wiring pattern at the IC mounting part based on the detection results are provided. Furthermore, a comparison device 22 which compares operation results with standard position data and uses the difference as a position error signal, a compensating means 24 which compensates the transfer stroke based on the position error signal, and an NC device 23 which installs the flat package IC on the wiring pattern at the IC mounting part are provided. Hereby, by the small and cheap device, the calculation of the position of the flat package IC can be done in high accuracy.</p> |
