发明名称 MANUFACTURE OF WIRING CIRCUIT BOARD
摘要 PURPOSE:To have both the functions as conventional photoresist and a protecting film by mixing conductive powder in the photoresist. CONSTITUTION:A conductive photoresist 5 mixed with carbon powder or metal powder such as of nickel by a roll coater method or a dip method is applied on a metal foil 2. A wiring circuit in which a conductive photoresist 8 is solidified is formed by irradiating light through a mask from the upper part of the resist 5 to develop. Metal foil 7 protected by the resist 8 solidified by performing etching is left and the metal foil 7 of the part without the resist 8 is eliminated. The solidified resist 8 becomes a protecting film as it is.
申请公布号 JPH0227789(A) 申请公布日期 1990.01.30
申请号 JP19880177384 申请日期 1988.07.15
申请人 SHARP CORP 发明人 OBARA ICHIRO
分类号 H05K3/06;H05K3/28 主分类号 H05K3/06
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