首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
FORMATION OF MULTILAYER INTERCONNECTION
摘要
申请公布号
JPH0226021(A)
申请公布日期
1990.01.29
申请号
JP19880175981
申请日期
1988.07.14
申请人
MATSUSHITA ELECTRON CORP
发明人
UEDA SEIJI
分类号
H01L23/522;H01L21/28;H01L21/768
主分类号
H01L23/522
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Method for producing a substrate arrangement
Automotive computing systems
Optical interleaver
High refractive index polysiloxane prepolymers
Diagnosis and treatment system for reward deficiency syndrome (RDS) and related behaviors
Power apparatus having built-in powerline networking adapter
Electrophoretic display with a bi-modal particle system
Valve to valve melt transfer device
Arm apparatus for mounting electronic devices
Cartridge style fluid dynamic bearing with conical or spherical bearing elements
Pressure sensor
Refrigerator and control method thereof
Alstroemeria plant named 'Zaprijul'
Internal combustion engine
Coupling vibration ultrasonic hand piece
Miniaturized spectrometer
Front end module
Image display device
Water-cooler radiator module
Multi-scraper structure for cleaning a panel
