| 摘要 |
<p>PURPOSE:To form a module for an IC card having sufficient rigidity and excellent durability certainly and easily by laminating a base material to a conductor made of stainless steel to integrate both of them and electrically connecting a bonding wire to the contact terminal part of the stainless steel conductor and an electronic part through the opening of the base material to seal the same by a seal resin. CONSTITUTION:Contact terminal parts 21 and bases 22 are continuously formed to a conductor 20 made of stainless steel and gold plating is directly applied to at least the rear of each of the contact terminal parts 21. Then, a base material 10 having cavities 11 and openings 12 formed thereto is integrated with said conductor 20 by an adhesive. The base material 10 and the stainless steel conductor 20 thus integrated are separated into individual pieces and an electronic part 40 is arranged and fixed to each cavity 11 of the base material 10. The terminal of the electronic part 40 is connected to the rear of each contact terminal part 21 exposed from each opening 12 of the base material 10 by a bonding wire 30 to be sealed by a seal resin 31.</p> |
