PICKUP METHOD OF SEMICONDUCTOR CHIP

摘要

PURPOSE:To enable a semiconductor chip to be picked up from an adhesive tape smoothly by adsorbing the semiconductor chip through the adhesive tape with a plurality of needles having a vacuum adsorption port and adsorbing the semiconductor chip with a collet placed at the semiconductor chip side. CONSTITUTION:An adhesive tape 3 at an area including at least one of a semiconductor chip 1 is adsorbed by a holder 6 placed at the side of an adhesive tape 3 and the semiconductor chip 1 is adsorbed through the adhesive tape 3 with a plurality of needles 7 having vacuum suction port being placed at the inside of the holder 6. Then, the semiconductor chip 1 is pressed against the edge surface of the collet 4 placed at the side of the semiconductor chip 1 by a needle 7. Furthermore, the semiconductor chip 1 is adsorbed by the collet 4. It prevents the collet 4 from contacting the adjacent semiconductor chip and enables the semiconductor chip 1 to be picked up smoothly without producing any crack or cutout at the semiconductor chip 1.