| 摘要 |
PURPOSE: To facilitate and automate production by processing circuit boards of a large number of kinds on an only one molding site by selectively using only the specific wire among a plurality of wires according to the specific circuit board to be molded having through-holes. CONSTITUTION: After mold stacks 10, 11 are closed, a core pin/wire keeping means including plates 82, 83 is moved to the right. The end parts of core pins and wires pass through a mold cavity 24 and, therefore, the end parts of the wires are seated within the blind hole 14 provided on the surface of a cavity block 10. Next, when a molding material is injected in the cavity 24, a circuit board having a specific pattern of through-holes according to a programmed pattern of the core pins and wires 18. After the molding material is cured, the plates 82, 83 are moved to the left to pull the end parts of the core pins and wires 18 out of the mold cavity 24. Next, a mold is opened and the substrate is discharged out of the mold cavity. |
