| 摘要 |
PURPOSE:To enable the crystalline substrate to be ground with high precision by a method wherein exceeding specific numbers of thickness controllers are provided. on the same circumference of the crystalline substrates. CONSTITUTION:Exceeding three each e.g., six each of thickness controllers 13 are buried in the positions on the same circumference on the main body of a crystalline substrate grinding jig 11 while the level of the controllers 13 is position-controlled from the bonded surface of the crystalline substrates with high precision. The crystalline substrates 12 are fixed in the circumference whereon the controllers 13 are arranged using wax 18. The adjusting load 15 is previously decided by the assumed ground status and grinding time of the crystalline substrates 12 after the grinding process. Consequently, the substrates 12 can be ground only by bonding the substrates 12 onto the main body 11 using the wax 18.
|
