METHOD OF PACKAGING ELECTRONIC COMPONENT,申请号JP19880176026-传众专利搜索

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发明名称	METHOD OF PACKAGING ELECTRONIC COMPONENT
摘要
申请公布号	JPH0225092(A)	申请公布日期	1990.01.26
申请号	JP19880176026	申请日期	1988.07.13
申请人	FUJITSU LTD	发明人	KOMIYAMA TAKESHI;SASAZAWA YOICHI
分类号	H05K3/34;H05K3/30	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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