发明名称 METHOD AND DEVICE FOR MACHINE POLISHING WITH LESS SURFACING AFFECTED LAYER TO BE GENERATED
摘要 PURPOSE:To extremely thin the thickness of a work affected layer and to increase the smoothness of the finishing surface thereof by pressing the rotating roll for polishing with an elastic material as its polishing face to the face to be polished by a specified pressure and polishing with feeding a specified polishing liquid to this pressing part. CONSTITUTION:A rotating roll (brush) 1 for polishing of an elastic material is pressed by the pressure of 3kg/cm<2> or less to the face to be polished of the body 2 to be polished. In this state, the face to be polished is smoothly subjected to polish finishing by this rotating roll 1 with feeding the polishing liquid contg. a fine abrasive grain of >=No.240 grain size at the rate of 15-60 for 100 liquid at wt.% to the vicinity of the face to be polished and the polishing rotating roll 1 getting into contact, namely to the pressing part of the rotating roll 1 from a mixture tank 4 with a stirring device 5, and the thickness of the work affected layer is extremely thinned.
申请公布号 JPH0224050(A) 申请公布日期 1990.01.26
申请号 JP19890023805 申请日期 1989.02.03
申请人 KAWASAKI STEEL CORP 发明人 NISHIIKE UJIHIRO;KOBAYASHI YASUHIRO;ISHIGE TSUNEO;KAMI TSUTOMU;SUJITA SHIGEKO;NAGAMINE TSUNEO
分类号 B24B29/00;B24B29/06 主分类号 B24B29/00
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