| 摘要 |
PURPOSE:To execute a trimming treatment without being restricted by a design of an IC by a method wherein a memory IC chip provided with a redundant circuit is divided into small divided regions, alignment marks are arranged, an alignment operation is executed and a fuse is blown in each divided region. CONSTITUTION:When a trimming treatment of a memory IC 1 provided with a redundant circuit is executed, a chuck is shifted in such a way that the center of a divided region 4 is always situated, in the center of a laser beam by using the region 4 as a reference. In the case of a good chip and a chip which cannot be relieved, the chuck is shifted by an amount of a size of a chip which is not divided. In the case of a chip which can be relieved, an alignment operation is executed and a fuse is blown in the divided region 4; after that, the chuck is shifted in such a way that the center of a divided region 5 is situated in the center of the laser beam. An alignment operation is executed and a fuse is blown in the divided region 5; after that, the chuck is shifted in such a way that the center of the divided region 4 for a next chip is situated in the center of the laser beam. Thereby, it is possible to execute the trimming treatment of the memory IC provided with the redundant circuit which is larger than a movable range of the laser beam. |
