| 摘要 |
PURPOSE:To facilitate soldering and fixing and to uniformize the solder thickness by supporting a chip carrier holding tool so that it can be freely slided and turned to a mount holding tool and providing a means which is brought into contact with the chip carrier holding tool to finely move it to the mount holding tool. CONSTITUTION:A chip carrier holding tool 32 is supported freely turnably around a supporting shaft 33 fixed to a mount holding tool 31, and the holding tool 32 is always closely brought into contact with the mount holding tool 31 by the energizing force of an energizing member 34. A pin 32a provided on the end part of the holding tool 32 is inserted to a chucking hole 28 of a chip carrier 21 and a metallic piece 32b energized and projected from the holding tool 32 is pressed from the side of the chip carrier 21, thereby holding the chip carrier 21 by the holding tool 32. A plate-shaped solder 37 interposed between the chip carrier 21 and a mount 11 is fused to solder them. Thus, the solder thickness is uniformized. |
