| 摘要 |
Thick film conductor composition comprises(in wt.%) : conductive material of which at least 28 wt.% is Cu 85-98.8 ; inorganic binder 10-1 ; and non-Cu material selected from W,Mo,Rh and their alloys 5- 0.2, the Cu particles having a max. size below 10 micron and mean size 2-4 micron, and the non-Cu particles having a max. size below 5 micron and mean size 0.2-3 microns. Conductive material is Cu(alloy) or a mixt. of Cu and a noble metal, espectially a cutectic mixture of Cu and Ag ; non-Cu metal is W. Composition retains good solderability even after multiple firings.
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