| 摘要 |
<p>PURPOSE:To obtain a highly reliable pin head diode in such a way that it is not only miniaturized but also shows high resistance to moisture and heat and then, no crack develops when surface mounting is carried out toward a printed wiring board by causing a resin in the vicinity of a semiconductor element piece and lead wire end face parts to have a prescribed resin composite. CONSTITUTION:After coating and setting, as the first resin 4 in the vicinity of a semiconductor element piece 2, a resin consisting of a bismaleimide-triazine resin monomer or a resin composite which has the bismaleimide-triazine resin monomer as a principal ingredient, the resin-mold is available by using an epoxy resin and the like which is mixed with fillers and is superior in resistance to moisture as the second resin 5. The resin consisting of the bismaleimide- triazine resin monomer exhibits a high heat resistance. In this way, when the semiconductor element piece is connected to end faces of a lead wire with solder, such a resin is used as the first resin 4 and then, strength of a soldered place is thus reinforced by its resin. As a result, utilization of such a resin thus prevents occurrences of defectives which are produced with the surface mounting of diodes toward a printed wiring board.</p> |
