| 摘要 |
<p>PURPOSE:To miniaturize a chip by reducing an electrode occupation rate by sharing a set of power supply pads VCC1 and a ground bonding pad GND 1 for a plurality of electronic circuit block power supplies not operable simultaneously, and sharing part of an electrode extending from the pad to each mat. CONSTITUTION:For example, an FM front/end block 24 is integrated on mats K-M, an FM-IF block 25 on mats E-I, and a noise canceller block 26 on mats N-P. An AM tuner block 28 is integrated on mats A-D. These blocks are crossed over through through-holes indicated by black circles and through a second layer electrode layer 79. Since the block 28 is not operable simultaneously with the external block circuits, the blocks 28 and 25 share one pad VCC1. Accordingly, the chip interior can effectually be utilized by sharing part of a power line and a ground line.</p> |
