| 摘要 |
PURPOSE:To form a Cu film having superior uniformity by electroless plating with superior depositability by pretreating the part of a resin board requiring plating with a specified silicone surfactant when the part is electroless-plated with Cu to produce a printed circuit board. CONSTITUTION:When the part of a board of an electrically nonconductive material such as resin requiring plating is electroless-plated with Cu to produce a printed circuit board, the part is pretreated by contact with a silicone surfactant having a pendently added polyether group represented by formula I (where each of R and R' is alkyl or H and m+n+x=3,000-4,000) as a side chain. By this pretreatment, a catalyst for electroless Cu plating is effectively adsorbed, bubbles in the through holes and blowholes in the board are rapidly removed and the occurrence of plating voids is prevented. |
