| 摘要 |
PURPOSE:To enhance the quality of a resin-sealing type semiconductor device by a method wherein, when the semiconductor device is sealed with a resin, a gate flow speed of a fused resin is detected and a plunger-lowering speed is controlled in order to keep the gate flow speed of the resin constant. CONSTITUTION:A lead frame where a semiconductor chip has been loaded is mounted on a transfer-molding metal mold 10; a tablet 8 is loaded; after that, a plunger 9 is lowered; the tablet 8 which has been heated and plasticized is passed through a gate 6 as a fluid. A flow speed during this process is detected by using Si flow-speed sensors 3, 4; a lowering speed of the plunger 9 is controlled to a definite value by using an adjusting device 1 and an oil- pressure valve 2; a resin-sealing operation can be executed stably. Accordingly, a mustache, a deformation of a wire or an imperfect sealing operation can be reduced to a minimum. |
