| 摘要 |
PURPOSE:To achieve accurate inspection by arranging a first positional deviation inspecting process and a second inspection process which further judges a positional deviation according to a relationship between an extraction image of an electrode and a scan line after deficiency is determined in the first positional deviation inspection process. CONSTITUTION:When the existence of a chip part A is recognized by a process for judging the presence of chip parts, a deficiency as a positional deviation is determined depending on a overlap between an extraction image of an electrode B of the chip part A and windows C1 and C2 in the first positional deviation inspection process. Here, when a silk printing E is applied on both sides of a position of mounting the chip part A, a chip part is determined to be defective even if mounted normally because of an overlapping between the extraction image of the silk printing E part and the windows C1 and C2. In this method, then, in a second positional deviation inspection process, two parallel scan lines L1 and L2 are made to perform a scanning in directions of two ends of the extraction image of the electrode B of the chip part A to measure distance of an end rim of the electrode B up to the extraction image. Thus, a product is determined to be acceptable if the lengths of the air of scan lines L1 and L2 are almost equal within the windows C1 and C2. |
