| 摘要 |
<p>A device for sticking adhesive tape (51) to thin articles, such as semiconductor wafers (3), and trimming excess portions of said tape (51) from the thin articles. A plurality of sticking rollers (45, 46) apply adhesive tape (51) from a roll to each thin article, the tape (51) having an adhesive side orientated towards an upper surface of the article and a width greater than the width of the article. A suction stage (108) receives and holds each of the thin articles with the adhesive tape (51) stuck thereto by said sticking rollers (45, 46) while a tape cutter (105) trims the excess portion of the tape from along peripheral edge portions of the article. A tape peeling device (54) then peels off the trimmed excess portions of the tape (51) from the thin article, whereupon the thin article is conveyed back to a cassette.</p> |
