| 摘要 |
PURPOSE:To improve hole reliability while holding a low dielectric constant by using a resin having a specified dielectric constant for printed circuit boards. CONSTITUTION:In a multilayer printed circuit board produced by interposing a resin impregnated base material between a pair of printed circuit boards and integrating them, the printed circuit boards used herein are formed from a resin having a dielectric constant of 3 or less. For example, three sheets of glass fabric impregnated with polyimide resin are interposed between a pair of double-sided printed circuit boards each consisting of a laminate of a glass fabric base material impregnated with thermosetting polyphenylene oxide resin and they are laminate molded into a four-layer printed circuit board. In this manner, the through hole reliability can be improved while a dielectric constant is kept low. |
