| 摘要 |
PURPOSE:To prevent bending of a part of pins and make it possible to easily couple the pins to a circuit substrate without exclusive socket by electrically insulating and integrating in each line the lead pins of package. CONSTITUTION:A package 11 is provided with two lines lead pins 12. The pins 12 are integrated for each line and an insulated sealing material 13 is provided so that the pin surface is exposed, and pins 12 in each line are electrically insulated. In such a structure, a part of pins 12 does not bend and fluctuation of pins can be prevented. At the time of coupling to a substrate, slits are provided on the circuit substrate in place of pin holes. Now the lead pin 12 can be inserted together with the insulated sealing material 13 and a device can be coupled to a circuit substrate. Thereafter, wiring is soldered to the exposed area 12a of the pin 12. As described above, coupling can be performed easily without using exclusive socket and drastic improvement of working efficiency and cost reduction can be realized. |
