发明名称 MULTILAYER PRINTED CIRCUIT BOARD
摘要 PURPOSE:To decrease defective product ratio, manufacturing cost and number of processes by disposing a base material impregnated with resin on the top and bottom faces of an inner layer material and further providing metallic foil having a predetermined thickness thereon as an outer layer material, the metallic foil having a predetermined amount of resin formed on the outermost layer. CONSTITUTION:An inner layer material is a laminate one face or both faces of which are plated with a metal to define an electric circuit. A base material impregnated with resin is disposed on the opposite faces of the inner layer material. An outer layer material provided by applying the resin used in said resin impregnated base material on one face of a metallic foil of copper, aluminum or the like having a thickness of 3 to 12 micrometers, such that an amount of the resin after dried becomes 1 to 100g/m<2>. Such outer layer material is arranged on the outermost layer. In this manner, it is possible to decrease the defective product ratio, manufacturing cost and number of processes.
申请公布号 JPH0221693(A) 申请公布日期 1990.01.24
申请号 JP19880171604 申请日期 1988.07.08
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 AZUMABAYASHI YASUO;SHIRAKAWA SADAHIRO
分类号 H05K3/46 主分类号 H05K3/46
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