DETECTION OF SOLDER BRIDGE

摘要

PURPOSE:To detect a solder bridge accurately by performing an optical scanning between leads of an electronic component with a camera arranged above the electronic component mounted on a substrate to detect a part having a brightness above a set value. CONSTITUTION:An electronic component 2 is mounted on a substrate 1, which is positioned with a positioning section 3 comprising XY tables 4 and 5. A camera 6 is arranged above leads 8 of the electronic part 2 while light sources 7a and 7b are arranged right above the lead and askew above it. A solder 10 is applied at the tip of the lead 8 and has a brightness higher than a pattern 14 printed on the substrate 1. The camera 6 performs an optical scanning between the leads 8 and 8 along the length thereof to detect a part having a brightness above the set value thereby enabling accurate detection of the solder bridge.