| 摘要 |
A method and apparatus for controlling the flow of solder and heat in metallic members. The apparatus includes a housing for receiving a portion of the metallic member in which the flow of solder and heat is to be controlled. A second portion of the metallic member in which the flow of heat and solder is desired is allowed to project from the housing. An inlet for a cooling medium is provided in the housing. According to the method of the invention, a cooling medium is directed into the housing, whereby molten solder and/or heat which is applied to the unenclosed portion of the metallic member is allowed to flow across the unenclosed portion but is terminated substantially at the point where the metallic member is enclosed by the housing.
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