SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE

摘要

PURPOSE:To obtain a semiconductor device of high reliability which is superior in heat conduction by fixing a lead frame on a board provided with a ceramic thin film layer on a metal material by resin. CONSTITUTION:After a ceramic thin film layer 1b such as aluminum nitride and alumina is provided on a metal material plate 1a such as aluminum and iron so as to form a board 1, an IC chip 9 is fixed by a resin layer 7 in a hollow part 15 surrounded by a lead frame 5 of copper, copper alloy and the like on the board 1 by an ordinary method, next the IC chip 9 and the lead frame 5 are connected by an aluminum fine wire 11, and they are sealed by a cap 13 made of ceramic or resin. A hollow part 15 works as a barrier for preventing moisture from permeating.