| 摘要 |
<p>The device that manufactures the semiconductor furnished with a bonding wire (80) between an electrode pad (56) and an outer lead comprises the means forming balls to furnish bonding wire of Cu or its alloy with part of the bonding wire ; the means transferring boding wires to press the balls on the pad ; the means putting pressure on the balls on the outer lead (44) at the rear bonding area. And this device is furnished with a wire bonding area and a rear bonding area splitted into different shapes, each other, in transferring path, to be able to transfer lead frame (40) along transferring direction.</p> |
