发明名称 MULTILAYER INTERCONNECTION SUBSTRATE
摘要 PURPOSE:To form structure difficult to be deformed to external force by shaping a plurality of holes to a second conductor pattern layer at the crossing section of first and second conductor pattern layers, removing an insulating layer between both conductor pattern layers and interposing an air layer. CONSTITUTION:A first conductor pattern layer 2 formed onto a substrate 1, an insulating layer 3 shaped onto the substrate 3 and the first conductor pattern layer 2 and a second conductor pattern layer 4 crossing with the first conductor pattern layer 2 are shaped onto the insulating layer 3, and a plurality of holes 5 are formed to the second conductor pattern layer 4 at the crossing section of the first and second conductor pattern layers 2, 4, thus removing the insulating layer 3 between both crossing conductor pattern layers 2, 4, then interposing an air layer 6. Consequently, a section between the first conductor pattern 2 and the second conductor pattern layer 4 is insulated by the air layer 6 while the second conductor pattern layer 4 is maintained to a plane shape. Accordingly, strength on structure is increased, thus preventing the disconncction of wirings, a short circuit, etc.
申请公布号 JPH0218992(A) 申请公布日期 1990.01.23
申请号 JP19880169950 申请日期 1988.07.06
申请人 SHARP CORP 发明人 YOSHIKAWA MITSUNORI
分类号 H05K3/46 主分类号 H05K3/46
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