| 摘要 |
PURPOSE:To shorten a bonding wire and to improve its yield by extending one end of a hanging lead from opposite face to a semiconductor chip attaching face of one side face of an island, extending to the top of the attaching face and further bending and extending in parallel with the attaching face. CONSTITUTION:A hanging lead 24 is disposed at the center of a lead 22 row, one end of the lead 24 is extended upward from the opposite side to a semiconductor chip attaching face 21a of one side face 21b of an island 21, protrudes upward at a distance D above the attaching face across the side face 21b of the island 21, is bent to be extended on the same surface as that of the lead 22 in parallel with the attaching face 21a. Accordingly, the lead 22 can be rapidly approached to the island 21. |
