| 摘要 |
In pull-testing wire bonds on an electrical device, an upward pulling force is applied to a wire loop by a motor-driven loading arm through a hook which is connected to the free end of a flexible cantilever beam in the arm. A strain gauge is provided on the beam to measure its deflection and thus the applied pulling force and supply a signal corresponding to this measured force. The actual forces applied to the bonds is calculated by generating a signal signifying the distance the hook has moved when the strain gauge starts to generate a signal.
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