SEMICONDUCTOR INTEGRATED CIRCUIT PACKAGE

摘要

PURPOSE:To obtain a semiconductor device of high reliability which is superior in heat conduction by fixing a lead frame on a ceramic board by resin. CONSTITUTION:After an IC chip 9 is fixed by a resin layer 7 on a hole part surrounded by a lead frame 5 on a ceramic board 1 and next the IC chip 9 and the lead frame 5 are connected by an aluminum fine wire 11, a hollow part 15 works as a barrier for preventing moisture from permeating because they are sealed by a cap 13 made of ceramic or resin.