发明名称 BONDING DEVICE
摘要 PURPOSE:To conveniently handle a bonding device by opening a hole of small diameter axially at a wedge, providing means for evacuating in vacuum the interior of the hole and means for moving an arm fulcrum for supporting the wedge, thereby using it as a vacuum chuck and bonding irrespective of the electrostatic charge. CONSTITUTION:A wedge 1 can be utilized as a vacuum chuck. That is, when the switch 14 is set to positive direction and switches 13, 15 are closed, a vacuum pump 9 operates, the hole 1-1 of small diameter of the wedge 1 operates as a vacuum chuck, a fulcrum 11 is raised by a feeding shaft 10 by the normal rotation of a motor 12, and the fulcrum 11 operates as the fulcrum of a horn 2. Accordingly, the position of the fulcrum 11 is provided at the position adapted to be used as the vacuum chuck. On the other hand, when used as a bonding, the fulcrum 11 is lowered by reversely operating the switch 14 so that the fulcrum 5 operates as the fulcrum of the horn 2. Then, the fulcrum 5 is provided at the position where the pressure adapted for the bonding actuates on the lower surface of the wedge 1.
申请公布号 JPS58124233(A) 申请公布日期 1983.07.23
申请号 JP19820007819 申请日期 1982.01.20
申请人 FUJITSU KK 发明人 SAKANE TOSHIROU
分类号 H01L21/52;H01L21/58;(IPC1-7):01L21/58 主分类号 H01L21/52
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